Precision laser

EPLC6080 Precision Optical Fiber Laser Kucheka Machine yePCB substrate

Tsanangudzo Pfupi

PCB substrate precision fiber laser yekucheka muchina inonyanya kushandiswa laser microprocessing sekucheka, kuchera, slotting, kumaka uye mamwe PCB aruminiyamu substrates, mhangura substrates, uye ceramic substrates.


  • Diki yekucheka seam upamhi:20 ~ 40um
  • High machining accuracy:≤±10um
  • Hunhu hwakanaka hwekucheka:yakatsetseka incision, kupisa kudiki kwakakanganisika nzvimbo, shoma burr uye mupendero chipping
  • Kukwenenzvera saizi:saizi shoma yechigadzirwa i20um
  • Product Detail

    PCB Substrate Precision Fiber Laser Kucheka Machine

    PCB substrate precision fiber laser yekucheka muchina inonyanya kushandiswa laser microprocessing senge laser yekucheka, kudhirowa uye kunyora kweakasiyana PCB substrates, iyo inogona kunzi PCB laser yekucheka muchina kwenguva pfupi.Zvakadai sePCB aluminium substrate yekucheka nekugadzira, mhangura substrate yekucheka nekugadzira, ceramic substrate kucheka uye kuumba, tinned mhangura substrate laser kuumba, chip kucheka uye kugadzira, nezvimwe.

    Technical Parameters:

    Maximum yekushandisa kumhanya 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
    Positioning kururama ±3um (X) ±3um (Y1&Y2) ±5um (Z);
    Repetitive positioning kururama ±lum (X) ±lum(Y1&Y2) ±3um(Z));
    Machining zvinhu precision Stainless simbi, hard alloy simbi uye zvimwe zvinhu pamberi kana mushure mekurapa kwepamusoro
    Material wall ukobvu 0~2.0±0.02mm;
    Ndege machining range 600mm * 800mm; (tsigiro yekugadzirisa kune yakakura fomati zvinodiwa)
    Laser mhando Fiber laser;
    Laser wavelength 1030-1070±10nm;
    Laser simba CW1000W&CW2000W&QCW150W&QCW450W&QCW750W yesarudzo;
    Equipment power supply 220V± 10%, 50Hz; AC 30A (main circuit breaker);
    File format DXF, DWG;
    Equipment dimensions 1750mm*1850mm*1600mm;
    Equipment uremu 1800Kg;

    Sample Exhibition:

    mufananidzo7

    Application scope
    Laser micromachining yendege uye yakakomberedzwa pamusoro zviridzwa zvechaiyo Stainless simbi uye yakaoma alloy pamberi kana mushure mekurapwa kwepamusoro.

    High precision machining
    Diki yekucheka seam hupamhi: 20 ~ 40um
    Kurongeka kwepamusoro kwekugadzira: ≤ ± 10um
    Hwakanaka mhando yekucheka: yakatsetseka incision & diki kupisa kwakakanganiswa nzvimbo & shoma burr
    Saizi kunatsiridza: yakaderera chigadzirwa saizi i100um

    Kuchinjika kwakasimba
    Kuve nekugona kwelaser kucheka, kudhirowa, kumaka uye kumwe kugadzira kwakanaka kwePCB substrate
    Inogona muchina PCB aluminium substrate, mhangura substrate, ceramic substrate uye zvimwe zvinhu
    1 Yakashongedzerwa neyakazvigadzira yakananga-dhiraivha mbozha mbiri-drive chaiyo inofamba chikuva, granite chikuva & yakavharwa shafting gadziriro.
    Inopa mbiri mbiri & yekuona chinzvimbo & otomatiki kurodha uye kurodha sisitimu & mamwe mabasa esarudzo
    1 Yakashongedzerwa neyakazvigadziridza refu & pfupi yakatarisa kureba yakapinza mhino & flat nozzle laser yekucheka musoro . Yakashongedzerwa yakagadziridzwa vacuum adsorption clamping fixture & slag guruva separation yekuunganidza module & guruva rekubvisa pombi system & kuchengetedza-kuputika-proof kurapwa system.
    Yakashongedzerwa neyakazvigadzira 2D & 2.5D & CAM software system yelaser micromachining

    Flexible design
    Tevera iyo dhizaini pfungwa yeergonomics, yakatetepa uye yakapfupika
    Flexible software & hardware function collocation, inotsigira yakasarudzika basa kumisikidzwa & nehungwaru kugadzirwa manejimendi
    Tsigira dhizaini yakanaka kubva pachikamu kusvika kune system level
    Vhura kutonga & laser micromachining software system iri nyore kushandisa & intuitive interface

    Technical certification
    ne CE
    ISO9001
    neIATF16949


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