UV laser yekucheka muchina
Ultraviolet laser yekucheka muchina unonyanya kushandiswa PCB laser segmentation uye kuchera, kamera, zvigunwe zvinozivikanwa module FPC yekucheka, kuvhurwa kwehwindo rebutiro firimu reakapfava uye rakaomarara bhodhi, kufumura uye kugadzira, silicon simbi sheet, ceramic sheet scribing, Ultra-yakaonda inoumbwa zvinhu. uye Copper foil, aluminium foil &, kabhoni faibha, girazi faibha, Pet, PI uye mamwe laser yekucheka kugadzirisa.Zvakajairwa zvakadai semhangura foil antenna yekucheka nekugadzira, PCB bhodhi kucheka nekugadzira, FPC kucheka nekugadzira, girazi fiber kucheka uye kuumba, firimu kucheka nekugadzira, goridhe-yakaputirwa probe kuumba, nezvimwe.
Technical Parameters:
Maximum yekushandisa kumhanya | 500mm/s(X);500mm/s(Y1Y2);50mm/s(Z)); |
Positioning kururama | ±3um(X)±3um(Y1Y2);±3um(Z); |
1Kudzokorora kwekumisikidza kwakarurama | ±1um(X);±1um(Y1Y2);±1um(Z); |
1Machining zvinhu | FPC & PCB & PET & PI & mhangura foil & aruminiyamu foil & kabhoni faibha & girazi faibha & composite zvinhu & ceramic nezvimwe zvinhu. |
Material wall ukobvu | 0~1.0±0.02mm; |
Ndege machining range | 400mm * 350mm; |
Laser mhando | UV fiber laser; |
1Laser wavelength | 355±5nm; |
1Laser simba | Nanosecond & picosecond, 10W & 15W yesarudzo |
1Laser frequency | 10 ~ 300KHz |
1Simba kugadzikana | <± 3% (kuenderera mberi kwekushanda kwemaawa gumi nemaviri); |
1Simba rekupa | 220V±10%,50Hz/60Hz;AC 20A(main circuit breaker) |
1Faira fomati | DXF, DWG & Gebar; |
Dimensions | 1200mm*1400mm*1800mm ; |
Equipment uremu | 1500Kg; |
Sample Exhibition:
Application scope
PCB Laser kupatsanura & kuchera;Kamera & chigunwe chekuzivikanwa module FPC yekucheka;Kuvhara firimu hwindo & kufumura uye kucheka kweakaomarara uye akapfava bonding ndiro;Silicon simbi sheet & Ceramic Scribing;Ultra yakaonda inoumbwa zvinhu & foil yemhangura & aruminiyamu foil & kabhoni faibha & girazi faibha & Pet & PI laser yekucheka machining.
High precision machining
Diki yekucheka seam hupamhi: 15 ~ 35um
Yepamusoro machining kunyatsoita ≤ 10um
Hwakanaka mhando yekucheka: yakatsetseka incision & diki kupisa kwakakanganiswa nzvimbo & shoma burr
Saizi kunatsa: yakaderera chigadzirwa saizi 50um
Kuchinjika kwakasimba
Iva nekugona kwelaser yekucheka, kudhirowa, kunyora, kunyora bofu uye imwe yakanaka machining tekinoroji yendege & yenguva dzose yakakomberedzwa pamusoro zviridzwa.
Inogona muchina FPC & PCB & PET & PI & mhangura foil & aluminium foil & kabhoni faibha & girazi fiber & composite zvinhu & ceramic nezvimwe zvinhu.
Ipa yakazvigadzira yakananga dhiraivha XY superposition mhando & kupatsanurwa mhando yakagadziriswa gantry chaiyo inofamba chikuva & otomatiki kurodha uye kurodha sisitimu yesarudzo.
Ipa basa rekutanga scan yebilateral CCD yekuona nzvimbo & otomatiki chinangwa kubata uye nzvimbo
Yakashongedzerwa nechaiyo vacuum adsorption fixture & guruva rekubvisa pombi system
Yakashongedzerwa neyakazvigadzira 2D & 2.5D CAM software system ye laser micromachining.
Flexible design
Tevera iyo dhizaini pfungwa yeergonomics, yakanaka uye ipfupi
Iko kusanganiswa kwesoftware uye Hardware mabasa anochinjika, anotsigira akasarudzika basa kumisikidzwa uye nehungwaru kugadzirwa manejimendi.
Tsigira dhizaini yakanaka uye yehunyanzvi kubva pachikamu chikamu kusvika padanho rehurongwa
Vhura mhando yekutonga, laser micro-machining software system, iri nyore kushandisa & intuitive interface
Technical certification
ne CE
ISO9001
neIATF16949